I had a hankering to do a non-stamped card, and this is what I came up with. I have been having a lot of fun lately playing with diecuts and I wanted to do some more. I confess that I used a couple of non-Stampin’ Up! products on this card, but the majority of the products are from Stampin’ Up! My husband gave me some gold glimmery paste for Christmas, and I really wanted to try it out. It adds some subtle shine that you can see more as you move the card around in the light. I also used a non-Stampin’ Up! die to create the stitched grid on the background. I really love the stitched “cover plate” dies, and I wish that Stampin’ Up! had more of them. So, I went rogue and tried a die from another company (may the Stampin’ Up! gods forgive me).

There are a couple of things that I want to call out that I did for this card that may not be obvious from the picture. First – I used the Adhesive Sheets behind the leaf diecut, and I stacked two of them together before I put them on the card. It is definitely less messy to go with this approach instead of using liquid glue. You may notice that the ends of the leaves aren’t sticking as well to the embossed layer, and that wouldn’t happen if I used the liquid glue. In this instance, I think it’s fine but I’ll keep it in mind for other projects. Second – I diecut and stacked 3 of the mat layer on the “for you” diecut. It helps it to stand out from the card without using Dimensionals, which can be a little tricky when you’re working with something with thin portions and an uneven layer beneath.

I’m submitting this card for the current Tic, Tac Toe Challenge. Can you believe that they are at challenge # 199?!? I wonder if they’ll be doing anything special for #200… My card is inspired by the middle row across: Die Cut, Green, and Layers. I have to say that it is really fun to look at the gallery for these challenges. The nature of the challenge means that there is a wide variety in what is submitted, and it’s fun to guess which “line” a submission is for.

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